- Hersteller:
-
- CUI Devices (2)
- Heatsink Material:
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- Fin Style:
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- Thermal Resistance:
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7 Datensätze
Bild | Teil | Hersteller | Beschreibung | Preis | Bestand | Aktion | |
---|---|---|---|---|---|---|---|
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CUI Devices | Heat Sinks heat sink, BGA... |
|
899
In-stock
|
Jetzt kaufen Angebot anfordern | ||
![]() |
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
|
94
In-stock
|
Jetzt kaufen Angebot anfordern | ||
![]() |
CUI Devices | Heat Sinks heat sink, BGA... |
|
1,102
In-stock
|
Jetzt kaufen Angebot anfordern | ||
![]() |
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
|
Angebot anfordern | |||
![]() |
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
|
Angebot anfordern | |||
![]() |
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
|
Angebot anfordern | |||
![]() |
Advanced Thermal Solutions | Heat Sinks maxiFLOW BG... |
|
Angebot anfordern |